FPC, Flexible circuit board, also known as PCB, is a type of PCB known for its high wiring density, lightweight, thinness, bendability, and flexibility. This type of board can withstand multiple dynamic bends without damaging the wires, adapt to three-dimensional assembly requirements, and achieve the integration of component assembly and wire connection, which is incomparable to other types of circuit boards. Driven by the vast FPC market in China, enterprises from multiple countries and regions have set up factories in China. By 2012, FPC, like rigid circuit boards, had undergone significant development. However, according to the product lifecycle theory, FPC is currently in a stage between its peak and decline in its lifecycle. In order to maintain market share, FPC must constantly innovate. So, how should FPC innovate in the future?
1. Thickness: The thickness of FPC needs to be more flexible and thinner;
2. Folding resistance: FPC must have stronger folding resistance, exceeding 10000 times, which requires better substrate;
3. Price: The price of FPC is relatively high compared to PCB. If the price decreases, the market will further expand;
4. Process level: In order to meet the needs of multiple parties, the process of FPC must be upgraded, and the minimum aperture and minimum line width/spacing must meet higher requirements.